Banana Pi BPI-SM10 (K3-CoM260) delivers up to 60 TOPS of general-purpose AI compute and can smoothly run 30-billion-parameter(30B) large models such as the 30B-A3B series. It offers highly accessible, user-friendly development environment for developers , students and makers.
The developer kit includes a BPI-SM10 Core module and universal reference carrier board. The carrier board is fully compatible with K3-CoM260 series and provides ready-to-use demos for edge AI agent development.
The BPI-SM10 (K3-CoM260) module integrates 8x100™ general-purpose CPU cores and 8x A100m Al CPU cores, delivering 130 KDMlPS of general compute and 60 TOPS of general Al compute Real-world testing shows inference performance is greater than 10 Tokens/S@30B. It supports multi-pipeline concurrent Al workloads and high-performance inference tasks. And the included carrier board offers a wide range of I/O interfaces while remaining hardware-compatible with NVIDIA Jetson Orin Nano to simplify hardware migration.
The BPI-SM10 (K3-CoM260) Developer Kit supports deployment of a broad set of Al algorithms and model types It follows a standard CPU programming model and provides system software, Al runtime, and a complete developer toolchain, enabling zero-effort migration of existing Al workloads.
Banana Pi also provides custom software development services, along with support for camera and sensor integration, carrier-board design, and full system engineering to accelerate productization
As the world’s first compact edge-computing platform based on the RISC-V architecture with full RVA23 support, the SpacemiT K3-CoM260 Developer Kit is idea for Al edge devices, service robots, and a wide range of autonomous on-device Al agent applications
8x X100™ 64-bit RISC-V CPU cores
4-issue out-of-order pipeline,12 stages.Compliant with the RVA23 specification.
Shared 8MB L2 cache
8 x A100™ 64-bit AI CPU cores
60 TOPS general-purpose Al compute
1024-bit RW 1.0 vector processing width
Shared 2MB L2+3 MB TCM
64-bit LPDDR5, 6400 MT/s
Support for external NVMe storage devices
Reference Carrier Board
2 x MlPI CSl-2 (22-pin) camera connectors
2x M.2 Key M, M.2 Key E
4x USB 3.0 Type-A
USB Type-C for UFP
Gigabit Ethernet port
Display Port
40-pin expansion header>MIPI DSI (30-pin) connector
DC power input
| HardWare Specification of Banana Pi BPI-SM10 RISC-V core board | |
|---|---|
Chip |
SpacemiT K3 RISC-V AI CPU |
CPU |
8x X100™ 64-bit RISC-V CPU cores, 2.4GHz |
2 clusters x 4 cores per cluster, each cluster includes 4 MB shared L2 cache, with cross-cluster access |
|
Each X100 cores includes 64 KB I-cache and 64 KB D-cache |
|
Complaint with the RVA23 profile |
|
Supports RVV 1.0, VLEN:256 bits |
|
AI performance |
8 x A100™ AI CPU cores, delivering 60 TOS |
2 cluster x 4 cores per cluster, each cluster includes 1 MB shared L2 cache and 1.5MB TCM(Tightly Coupled Memory), with cross-cluster access |
|
Each A100 core includes 32KB I-cache and 32KB D-cache |
|
Supports RVV 1.0, VLEN:1024 bits |
|
GPU |
Integrated 3D GPU, with support for Vulkan, openCL, and openGL ES |
Memory |
8GB/16GB/32GB 64-bit LPDDR5,6400MT/s |
Storage |
supports internal UFS, SD card, and external NVMe |
video Encoding |
4K60 (H.264/H.265) |
video Decoding |
1 x 4K120 (H2.64/H.265/VP9) |
2 x 4K60 (H2.64/H.265/VP9) |
|
8 x 1080P60 (H2.64/H.265/VP9) |
|
16 x 1080P30 (H2.64/H.265/VP9) |
|
Power consumption |
18W-35W |
| Refer to the software Features section of the latest SpacemiT K3 Datasheet for a list of supported features. |
| HardWare Specification of Banana Pi BPI-SM10 RISC-V Carrier Board | |
|---|---|
camera |
2xMIPI CSI-2, 22-pin camera connectors |
PCIe |
M.2 Key M slot (PCIe Gen 3 x 4) |
M.2 key M slot (PCIe Gen 3 x 1) |
|
M.2 key E slot |
|
USB |
4 x USB 3.0 Type-A |
1 x USB Type-C(UFP device mode supported) |
|
Networking |
1 x GbE connector |
Display |
1 x DP 1.2 connector |
1 x MIPI DSI-1.2 30-pin display connector |
|
Other I/O |
pin expansion header (UART,SPI, I2S, I2C, GPIO) |
pin button header |
|
pin fan header |
|
DC power jack |
|
Mechanical |
103mm x 90.5mm x35mm (Height includes feet, carrier board, module and thermal solution) |